• DocumentCode
    2390815
  • Title

    A reliable die attach method for high power semiconductor lasers and optical amplifiers

  • Author

    Merritt, S.A. ; Heim, P.J.S. ; Cho, S. ; Dagenais, M.

  • Author_Institution
    Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
  • fYear
    1995
  • fDate
    21-24 May 1995
  • Firstpage
    428
  • Lastpage
    430
  • Abstract
    We have developed a reliable, high yield, void-free method for soldering high power semiconductor laser diodes epitaxy-side down. We have consistently obtained absolute thermal resistances as low at 1.5°C/Watt and specific thermal resistances of 4·10-3 K·cm2/Watt on oxygen-free high conductivity (OFHC) copper heatsinks. This method has very wide process margins (75°C), exhibits excellent repeatability (4%), and is suitable for laser die attach to diamond submounts
  • Keywords
    chemical interdiffusion; heat sinks; microassembling; semiconductor lasers; soldering; thermal resistance; C; Cu; diamond submounts; die attach method; high power semiconductor lasers; high yield method; optical amplifiers; oxygen-free high conductivity Cu heatsinks; soldering; thermal resistance; void-free method; Copper; Diode lasers; Heat sinks; Microassembly; Power lasers; Semiconductor device reliability; Semiconductor lasers; Soldering; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1995. Proceedings., 45th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-2736-5
  • Type

    conf

  • DOI
    10.1109/ECTC.1995.515316
  • Filename
    515316
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2390815