• DocumentCode
    2392296
  • Title

    Transport Layer Assisted Routing for Non-Stationary Irregular mesh of thermal-aware 3D Network-on-Chip systems

  • Author

    Chao, Chih-Hao ; Yin, Tsu-Chu ; Lin, Shu-Yen ; Wu, An-Yeu

  • Author_Institution
    Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2011
  • fDate
    26-28 Sept. 2011
  • Firstpage
    284
  • Lastpage
    289
  • Abstract
    Thermal issue is important for 3D Network-on-Chip systems. To ensure thermal safety, run-time thermal management is required. However, the regulation of temperature requires throttling of the near-overheated router, which makes the topology become Non-Stationary Irregular mesh (NSI-mesh). To successfully deliver packet in NSI-mesh, we propose the Transport Layer Assisted Routing (TLAR) scheme and two algorithms for thermal-aware 3D NoC. Based on the experimental results, the proposed routing scheme can reduce the latency over 57.5% and improve the throughput above 1.47×.
  • Keywords
    network-on-chip; telecommunication network routing; thermal management (packaging); nonstationary irregular mesh; run-time thermal management; thermal safety; thermal-aware 3D NoC; thermal-aware 3D network-on-chip systems; transport layer assisted routing; Loading; Network topology; Payloads; Routing; Temperature sensors; Three dimensional displays; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference (SOCC), 2011 IEEE International
  • Conference_Location
    Taipei
  • ISSN
    2164-1676
  • Print_ISBN
    978-1-4577-1616-4
  • Electronic_ISBN
    2164-1676
  • Type

    conf

  • DOI
    10.1109/SOCC.2011.6085086
  • Filename
    6085086