DocumentCode
2392296
Title
Transport Layer Assisted Routing for Non-Stationary Irregular mesh of thermal-aware 3D Network-on-Chip systems
Author
Chao, Chih-Hao ; Yin, Tsu-Chu ; Lin, Shu-Yen ; Wu, An-Yeu
Author_Institution
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2011
fDate
26-28 Sept. 2011
Firstpage
284
Lastpage
289
Abstract
Thermal issue is important for 3D Network-on-Chip systems. To ensure thermal safety, run-time thermal management is required. However, the regulation of temperature requires throttling of the near-overheated router, which makes the topology become Non-Stationary Irregular mesh (NSI-mesh). To successfully deliver packet in NSI-mesh, we propose the Transport Layer Assisted Routing (TLAR) scheme and two algorithms for thermal-aware 3D NoC. Based on the experimental results, the proposed routing scheme can reduce the latency over 57.5% and improve the throughput above 1.47×.
Keywords
network-on-chip; telecommunication network routing; thermal management (packaging); nonstationary irregular mesh; run-time thermal management; thermal safety; thermal-aware 3D NoC; thermal-aware 3D network-on-chip systems; transport layer assisted routing; Loading; Network topology; Payloads; Routing; Temperature sensors; Three dimensional displays; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference (SOCC), 2011 IEEE International
Conference_Location
Taipei
ISSN
2164-1676
Print_ISBN
978-1-4577-1616-4
Electronic_ISBN
2164-1676
Type
conf
DOI
10.1109/SOCC.2011.6085086
Filename
6085086
Link To Document