DocumentCode
2393080
Title
TSV sharing through multiplexing for TSV count minimization in high-level synthesis
Author
Tu, Wen-Pin ; Lee, Yen-Hsin ; Huang, Shih-Hsu
Author_Institution
Dept. of Electron. Eng., Chung Yuan Christian Univ., Chungli, Taiwan
fYear
2011
fDate
26-28 Sept. 2011
Firstpage
156
Lastpage
159
Abstract
TSV count minimization is an important topic for 3D ICs. In previous works, TSV sharing is limited to the same functional unit output and the same functional unit input. In this paper, we present the first attempt to use multiplexers to extend TSV sharing for cross-layer data transfers that have different functional unit outputs and different functional unit inputs. We use an ILP (integer linear programming) to formally draw up the simultaneous application of resource binding, layer assignment, and TSV sharing (through multiplexing) to minimize the TSV count. Compared with previous works, our approach can greatly further reduce the TSV count.
Keywords
high level synthesis; integer programming; linear programming; minimisation; multiplexing equipment; three-dimensional integrated circuits; 3D IC; ILP; TSV count minimization; TSV sharing; cross-layer data transfers; functional unit input; functional unit output; high-level synthesis; integer linear programming; three dimensional integrated circuit; through-silicon-via minimization; through-silicon-via sharing; Adders; Benchmark testing; Integrated circuit interconnections; Minimization; Multiplexing; Three dimensional displays; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference (SOCC), 2011 IEEE International
Conference_Location
Taipei
ISSN
2164-1676
Print_ISBN
978-1-4577-1616-4
Electronic_ISBN
2164-1676
Type
conf
DOI
10.1109/SOCC.2011.6085124
Filename
6085124
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