• DocumentCode
    2393080
  • Title

    TSV sharing through multiplexing for TSV count minimization in high-level synthesis

  • Author

    Tu, Wen-Pin ; Lee, Yen-Hsin ; Huang, Shih-Hsu

  • Author_Institution
    Dept. of Electron. Eng., Chung Yuan Christian Univ., Chungli, Taiwan
  • fYear
    2011
  • fDate
    26-28 Sept. 2011
  • Firstpage
    156
  • Lastpage
    159
  • Abstract
    TSV count minimization is an important topic for 3D ICs. In previous works, TSV sharing is limited to the same functional unit output and the same functional unit input. In this paper, we present the first attempt to use multiplexers to extend TSV sharing for cross-layer data transfers that have different functional unit outputs and different functional unit inputs. We use an ILP (integer linear programming) to formally draw up the simultaneous application of resource binding, layer assignment, and TSV sharing (through multiplexing) to minimize the TSV count. Compared with previous works, our approach can greatly further reduce the TSV count.
  • Keywords
    high level synthesis; integer programming; linear programming; minimisation; multiplexing equipment; three-dimensional integrated circuits; 3D IC; ILP; TSV count minimization; TSV sharing; cross-layer data transfers; functional unit input; functional unit output; high-level synthesis; integer linear programming; three dimensional integrated circuit; through-silicon-via minimization; through-silicon-via sharing; Adders; Benchmark testing; Integrated circuit interconnections; Minimization; Multiplexing; Three dimensional displays; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference (SOCC), 2011 IEEE International
  • Conference_Location
    Taipei
  • ISSN
    2164-1676
  • Print_ISBN
    978-1-4577-1616-4
  • Electronic_ISBN
    2164-1676
  • Type

    conf

  • DOI
    10.1109/SOCC.2011.6085124
  • Filename
    6085124