• DocumentCode
    2393580
  • Title

    Flow network modeling: a case study in expedient system prototyping

  • Author

    Minichiello, Angie

  • Author_Institution
    Syst. & Technol. Sect., Hewlett-Packard Co., Fort Collins, CO, USA
  • Volume
    1
  • fYear
    2000
  • fDate
    2000
  • Lastpage
    77
  • Abstract
    Fortunately for engineers responsible for thermal management of today´s electronic systems, many tools exist that provide for efficient, comprehensive thermal design. These tools, including heat transfer correlations, Computational Fluid Dynamics (CFD) solvers, and Flow Network Modeling (FNM) techniques, assist engineers in answering complex layout questions and proposing thermally feasible design alternatives quickly. This paper presents the use of FNM as proposed by G. Ellison (1984), to perform a first order thermal analysis on a next-generation mid-range computer design. Ellison´s method is used to predict system level pressure drops and air-mover performance in the complex computer system prior to building hardware, performing sub-system flow measurements or completing system level CFD analyses. In this application, the use of FNM allowed a small design team to sufficiently validate the system layout early in the product´s design cycle, enabling continued sub-system layout, detailed design; and prototype production within the constraints of the project´s aggressive schedule. Results of the Ellison based approach are compared with those of a commercially available FNM software package and with data taken from a system prototype. Comparison shows that the results agree well, validating the use of FNM as an aid in developing thermally feasible computer designs
  • Keywords
    cooling; forced convection; thermal analysis; thermal management (packaging); air-mover performance; design cycle; design team; first order thermal analysis; flow network modeling; layout; next-generation mid-range computer design; sub-system layout; system layout; system level pressure drops; system prototyping; thermal design; thermal management; thermally feasible computer designs; Computational fluid dynamics; Design engineering; Engineering management; Heat engines; Performance analysis; Prototypes; Software prototyping; Thermal engineering; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-5912-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2000.866810
  • Filename
    866810