• DocumentCode
    2395689
  • Title

    Proceedings IEEE International Conference on Wafer Scale Integration (ICWSI)

  • fYear
    1995
  • fDate
    18-20 Jan. 1995
  • Abstract
    The following topics were dealt with: WSI applications; architecture; interconnect and routing; yield and test
  • Keywords
    integrated circuit design; integrated circuit interconnections; integrated circuit testing; integrated circuit yield; network routing; wafer-scale integration; WSI applications; architecture; interconnect; routing; test; wafer scale integration; yield;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1995. Proceedings., Seventh Annual IEEE International Conference on
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-2467-6
  • Type

    conf

  • DOI
    10.1109/ICWSI.1995.515432
  • Filename
    515432