DocumentCode
2396525
Title
Design and fabrication of neural implant with thick microchannels based on flexible polymeric materials
Author
Benmerah, Samia ; Lacour, Stéphanie P. ; Tarte, Edward
Author_Institution
Sch. of Eng., Univ. of Birmingham, Birmingham, UK
fYear
2009
fDate
3-6 Sept. 2009
Firstpage
6400
Lastpage
6403
Abstract
Mechanical guidance can be used to provide a supporting structure through which and onto which regenerating axons can grow. The dimensions of the mechanical guide need to be suitable to support regenerated axon outgrowth and vascularisation. In this paper, we present the design and fabrication process of a three-dimensional (3D) device comprising a bundle of parallel (100mum times 100mum) microchannels with embedded electrodes. This device can be used as a 3D electrode interface for peripheral nerve repair. The skeleton of the device is entirely made of flexible polyimide films. Gold microelectrodes and microchannels of photosensitive polyimide are patterned directly on polyimide substrates. After fabrication, the 2D electrode channel array is rolled into a 3D channel bundle that fits the anatomy of the peripheral nerve. Samples are rolled and inserted into 1.5 mm inner diameter tube.
Keywords
bioMEMS; biomedical electrodes; gold; microchannel flow; microelectrodes; neurophysiology; polymer films; prosthetics; 2D electrode channel array; 3D channel bundle; axon regeneration; flexible polymeric material; gold microelectrode; mechanical guidance; mechanical guide; microchannels; neural implant fabrication; peripheral nerve repair; photosensitive polyimide film; size 100 mum; supporting structure; three-dimensional device; vascularisation; Action Potentials; Elastic Modulus; Electrodes, Implanted; Equipment Design; Equipment Failure Analysis; Guided Tissue Regeneration; Miniaturization; Nerve Regeneration; Peripheral Nerves; Polymers; Prostheses and Implants;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location
Minneapolis, MN
ISSN
1557-170X
Print_ISBN
978-1-4244-3296-7
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2009.5333723
Filename
5333723
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