• DocumentCode
    2405547
  • Title

    Modeling of multi-layered power distribution planes including via effects using transmission matrix method

  • Author

    Kim, Joong-Ho ; Matoglu, Erdem ; Choi, Jinwoo ; Swaminathan, Madhavan

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    59
  • Lastpage
    64
  • Abstract
    This paper presents a method for analyzing multilayered power distribution networks in the frequency domain. Using a two dimensional array of distributed RLCG circuits, multi-layered power distribution planes are represented. Each plane pair is connected by vias, which are modeled as partial self and mutual inductors. For the efficient computation of the power distribution impedances at specific points in the network, a multiinput and multi-output transmission matrix method has been used, which is much faster than Spice and reduces memory requirements. This method has been compared with the cavity resonator method simulated in Spice
  • Keywords
    circuit analysis computing; digital integrated circuits; distributed parameter networks; equivalent circuits; frequency-domain analysis; inductance; integrated circuit interconnections; integrated circuit modelling; transmission line matrix methods; 2D array; distributed RLCG circuits; equivalent circuit; frequency domain; multi-input transmission matrix method; multi-output transmission matrix method; multilayered power distribution networks; partial mutual inductors; partial self inductors; power distribution impedances; two dimensional array; via effects; Cavity resonators; Circuits; Computational modeling; Computer networks; Distributed computing; Frequency domain analysis; Impedance; Inductors; Power distribution; Power systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2002. Proceedings of ASP-DAC 2002. 7th Asia and South Pacific and the 15th International Conference on VLSI Design. Proceedings.
  • Conference_Location
    Bangalore
  • Print_ISBN
    0-7695-1441-3
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2002.994886
  • Filename
    994886