Modeling of the electrical performance of the power and ground supply for a PC microprocessor on a card

Author

Fang, Jiayuan ; Herrell, Dennis ; Zhao, Jin ; Zhang, Jingping ; Chen, Raymond

Author_Institution

Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA

fYear

1998

fDate

26-28 Oct 1998

Firstpage

116

Lastpage

119

Abstract

The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a ball grid array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis. The effects of decoupling capacitors of different types and at different locations are investigated to achieve the objectives of low power and ground impedance and no or insignificant resonances inside the package

Keywords

ball grid arrays; capacitors; circuit resonance; electric impedance; electromagnetic fields; integrated circuit modelling; integrated circuit packaging; microprocessor chips; BGA package; PC microprocessor; PC microprocessor package; ball grid array; card-mounted microprocessor; decoupling capacitors; dynamic electromagnetic field analysis; electrical characteristics; electrical performance modelling; ground impedance; ground supply; package resonance; power impedance; power supply; Analytical models; Capacitors; Circuit simulation; Electromagnetic fields; Frequency; Impedance; Microprocessor chips; Packaging; Power supplies; Resonance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.733886

Filename

733886