Electromagnetic modeling of wafer-level silicon electro-optical packages for 10 & 40 Gb/s communications

This paper presents the electromagnetic (EM) 3-D modeling, hardware measurement, and optimization of hybrid packaged electro-optical transmitters. The initial application is targeted for 10 Gb/s Ethernet and SONET fiber optic communication links. The hybrid package includes a micromachined silicon optical bench, a InP laser and monitor photodiode, a hermetically-sealed lid, integrated impedance-matching resistor, and a flexible RF substrate with additional matching circuits designed to connect to standard driver and control electronics. The measured return loss is better than 10 dB past 10 GHz for two current prototype topologies and simulations show a good match to 40 GHz in a new broadband design.