• DocumentCode
    2408941
  • Title

    Power distribution for highly parallel WSI architectures

  • Author

    Johnstone, K.K. ; Butcher, J.B.

  • fYear
    1989
  • fDate
    3-5 Jan 1989
  • Firstpage
    203
  • Lastpage
    214
  • Abstract
    An investigation of the transient noise-coupled currents and their effect on voltage integrity is discussed. The investigation has been undertaken using an extracted-load simulation technique with a typical fine-grain systolic array-based architectures as the research vehicle. Simulation results indicate that potentially harmful power supply resonances of up to 40-ns duration can occur. Although these can be brought under control with peripheral decoupling components, serious problems associated with the maintenance of acceptable voltage integrity, with standard power distribution technology can occur when the device size is increased beyond 35-mm on a side. Although such sizes are significantly larger than current VLSI, they are clearly at least a factor or two less than monolithic WSI, thus suggesting that an alternative power distribution technology must be sought
  • Keywords
    VLSI; cellular arrays; power supply circuits; architectures; extracted-load simulation technique; fine-grain systolic array-based architectures; highly parallel; monolithic WSI; peripheral decoupling components; power distribution technology; power supply resonances; transient noise-coupled currents; voltage integrity; Circuit noise; Current supplies; Power distribution; Power supplies; Power systems; Resonance; Systolic arrays; Very large scale integration; Voltage; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-8186-9901-9
  • Type

    conf

  • DOI
    10.1109/WAFER.1989.47551
  • Filename
    47551