Full wave analysis and development of circuit models for flip chip interconnects

Author

Staiculescu, Daniela ; Liang, Hongwei ; Laskar, Joy ; Mather, John

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1998

fDate

26-28 Oct 1998

Firstpage

241

Lastpage

244

Abstract

This paper presents a full electromagnetic wave analysis at bump interconnects in flip chip packages. From measurement and simulation, a simple and accurate lumped element model has been developed for such flip chip interconnects. Based on our analysis, we provide basic design guidelines for flip-chip operation to 20 GHz

Keywords

circuit simulation; electromagnetic field theory; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; microwave integrated circuits; 20 GHz; bump interconnects; circuit models; design guidelines; flip chip interconnects; flip chip package measurement; flip chip packages; flip-chip operation; full electromagnetic wave analysis; full wave analysis; lumped element model; simulation; Circuit simulation; Coplanar waveguides; Flip chip; Integrated circuit interconnections; Packaging; Performance analysis; Performance evaluation; Semiconductor device measurement; Testing; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.734009

Filename

734009