DocumentCode
2409578
Title
Lid adhesive failure study for flip chip packaging
Author
Ong, M.C. ; Zhao, X.L. ; Joman, P.P. ; Chin, J.M. ; Master, Raj N.
Author_Institution
Device Anal. Lab., Adv. Micro Devices Pte Ltd., Singapore
fYear
2008
fDate
7-11 July 2008
Firstpage
1
Lastpage
4
Abstract
This paper studied the factors of causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.
Keywords
X-ray photoelectron spectra; adhesive bonding; flip-chip devices; FTIR; XPS; adhesive curing mechanism; flip chip packaging; lid adhesive failure study; surface behaviour analysis; Adhesives; Bonding forces; Curing; Flanges; Flip chip; Heat sinks; Heat transfer; Packaging; Sealing materials; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location
Singapore
Print_ISBN
978-1-4244-2039-1
Electronic_ISBN
978-1-4244-2040-7
Type
conf
DOI
10.1109/IPFA.2008.4588171
Filename
4588171
Link To Document