DocumentCode
2414706
Title
Decomposing protein interactome networks by graph entropy
Author
Lian, Hao ; Song, Chengsen ; Cho, Young-Rae
Author_Institution
Dept. of Comput. Sci., Baylor Univ., Waco, TX, USA
fYear
2010
fDate
18-21 Dec. 2010
Firstpage
585
Lastpage
589
Abstract
Recent high-throughput experimental methods have generated protein-protein interaction data in the genome scale, called interactome. Various graph clustering algorithms have been applied to the protein interactome networks for identifying protein complexes and predicting functional modules. Although the previous algorithms are scalable and robust, their accuracy is still limited because of complex connectivity of the networks. In this study, we propose a novel information-theoretic definition, Graph Entropy, as a measure of structural complexity of a graph. Loss of graph entropy represents an increase in modularity of the graph. Based on this concept, we present a graph clustering algorithm. Starting from a random seed vertex and its neighbors as a seed cluster, the algorithm iteratively adds or removes vertices on the border of the cluster to minimize graph entropy. We make an additional improvement on the algorithm for generating overlapping clusters. In the experiments with the yeast protein interactome network, we show the graph entropy-based approach has higher accuracy in predicting functional modules than other competing methods.
Keywords
bioinformatics; genomics; molecular biophysics; proteins; competing method; genome scale; graph clustering algorithm; graph entropy; high-throughput experimental method; information-theoretic definition; protein complexes; protein-protein interaction data; random seed vertex; yeast protein interactome network; Accuracy; Bioinformatics; Clustering algorithms; Entropy; Prediction algorithms; Protein engineering; Proteins; graph clustering; interactome; protein interaction networks; protein-protein interactions;
fLanguage
English
Publisher
ieee
Conference_Titel
Bioinformatics and Biomedicine (BIBM), 2010 IEEE International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-8306-8
Electronic_ISBN
978-1-4244-8307-5
Type
conf
DOI
10.1109/BIBM.2010.5706633
Filename
5706633
Link To Document