Investigation of the adhesion properties between COxMOy alloys and porous low-k

In this work, the adhesion properties between different metal films, including Co, Mo, and novel single layer barrier - CoMo alloys with porous low-k dielectrics (k=2.3) have been investigated by using Four-point bending (FPB) tests for the first time. The results show that, Mo has the highest adhesion energy with porous low-k, while Co has the lowest among the test material including reference Ta/TaN. The adhesion ability between Co_xMo_y films and low-k dielectrics is increased as the Mo concentration increases.