• DocumentCode
    2419270
  • Title

    The effect of duty cycle on SMPS common mode emissions: theory and experiment

  • Author

    Nave, Mark J.

  • Author_Institution
    EMC Services Inc., Seminole, FL, USA
  • fYear
    1989
  • fDate
    23-25 May 1989
  • Firstpage
    211
  • Lastpage
    216
  • Abstract
    The theoretical time- and frequency-domain waveforms of common-mode conducted emissions are derived for a switched mode power supply (SMPS) of arbitrary duty cycle. The dependence of common-mode emissions on duty cycle and switching frequency is derived, modeled, and verified through experimental data. A special fly-back converter was built to isolate the switching transistor heat-sink parasitic capacitance from other potential sources. Data on the common-mode emissions from this source were taken utilizing the line impedance stabilization network measurement method. Time-domain and frequency-domain data were taken for different supply operation parameters (states). The varying common-mode emissions of the supply were compared to that predicted by an earlier model. The magnitudes of the common-mode emissions are shown to be independent of switching transistor risetime. Using Fourier analysis of the common-mode waveform, the model predicts the variation of emissions with duty cycle value
  • Keywords
    electromagnetic interference; switched mode power supplies; EMI; Fourier analysis; SMPS common mode emissions; common-mode waveform; conducted emissions; duty cycle; fly-back converter; frequency-domain waveforms; line impedance stabilization network; measurement method; parasitic capacitance; supply operation parameters; switched mode power supply; switching transistor heat-sink; time-domain waveform; Electromagnetic compatibility; Electromagnetic interference; Frequency; Laplace equations; Parasitic capacitance; Switched-mode power supply; Switches; Time domain analysis; Virtual manufacturing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1989., IEEE 1989 National Symposium on
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/NSEMC.1989.37182
  • Filename
    37182