DocumentCode
241928
Title
Finfet and gate-all-around device design and performance/yield optimization
Author
Gossmann, Hans-Joachim L.
Author_Institution
Appl. Mater., Varian Semicond. Equip., Gloucester, MA, USA
fYear
2014
fDate
28-31 Oct. 2014
Firstpage
1
Lastpage
4
Abstract
The three-dimensional (3D) nature of Fin-, Nanowire-, or Gata-All-Around-FETs raises a host of unique challenges to device design and optimization. The sensitivity of a FinFET´s threshold voltage (Vth) to the Vth-implant is much lower than in a planar FET but can be improved by 5× through a change in the integration flow (“Well-Implant-Before-STI-Recess”). There still is a Halo implant in a FinFET that is analogous to the Halo implant in planar devices used for device-performance tuning. Unique to FinFETs is a 2nd “Halo” implant, which is effective for Vth adjustment. A Source-Drain-Extension (SDE) implant is instrumental for control of recess-spacer/recess-etch variability.
Keywords
MOSFET; nanowires; optimisation; semiconductor industry; FinFET; SDE implant; device-performance tuning; gate-all-around device design; gate-all-around-FET; halo implant; nanowire-FET; performance/yield optimization; recess-spacer/recess-etch variability; source-drain-extension; well-implant-before-STI-recess; Abstracts; Annealing; FinFETs; Implants; Logic gates; Optimization; Three-dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4799-3296-2
Type
conf
DOI
10.1109/ICSICT.2014.7021391
Filename
7021391
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