• DocumentCode
    2420061
  • Title

    Preparation and properties of epoxy-organically modified layered silicate nanocomposites

  • Author

    Imai, Takahiro ; Hirano, Yoshihiko ; Hirai, Hisayuki ; Kojima, Susumu ; Shimizu, Toshio

  • Author_Institution
    Chem. & Electr. Insulation Technol. Dept., Toshiba Corp., Kawasaki, Japan
  • fYear
    2002
  • fDate
    7-10 Apr 2002
  • Firstpage
    379
  • Lastpage
    383
  • Abstract
    Epoxy-silicate nanocomposites were prepared by dispersing synthetic layered silicates modified with alkylammonium ions. In the dispersing process, the organically modified layered silicates were mixed in epoxy resin with shearing, and aggregations of the silicates were removed by centrifugal separation after mixing epoxy resin and silicates. Micrographs taken by transmission electron microscopy (TEM) indicate that the nanocomposites have a mixed morphology including both parallel silicate layers (0.1-0.5 μm, 5-15 layers) and exfoliated silicate layers (nano-scale dispersion) area. In terms of thermal resistance properties, the glass transition temperature (Tg) of the nanocomposite was shifted to a higher temperature (Δ20°C) than pure epoxy. Furthermore, dispersion of modified silicate prevented relative permittivity (εr) and dielectric loss (tanδ) from increasing at a high temperature above the glass transition temperature.
  • Keywords
    composite insulating materials; dielectric loss measurement; epoxy insulation; glass transition; insulation testing; nanostructured materials; permittivity measurement; transmission electron microscopy; 0.1 to 0.5 micron; TEM; aggregations; alkyl-ammonium ions; centrifugal separation; dielectric loss; epoxy resin; epoxy-silicate nanocomposites; glass transition temperature; micrographs; mixed morphology; nanocomposites; parallel silicate layers; relative permittivity; shearing; synthetic layered silicates dispersion; thermal resistance properties; transmission electron microscopy; Dielectric losses; Epoxy resins; Glass; Morphology; Nanocomposites; Permittivity; Shearing; Temperature; Thermal resistance; Transmission electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2002. Conference Record of the 2002 IEEE International Symposium on
  • Print_ISBN
    0-7803-7337-5
  • Type

    conf

  • DOI
    10.1109/ELINSL.2002.995955
  • Filename
    995955