DocumentCode
2421181
Title
Reversibly bonded nanocapillaries by electrostatic forces
Author
Kim, Pilnam ; Baik, Seunghyun ; Suh, Kahp Y.
Author_Institution
Sch. of Mech. & Aerosp. Eng., Seoul Nat. Univ.
fYear
2007
fDate
16-19 Jan. 2007
Firstpage
890
Lastpage
894
Abstract
Reversibly bonded nanocapillaries (500 - 50 nm) were fabricated on gold and silicon substrates using electrostatic forces that can be generated on a rigiflex mold upon removal from an original, engraved silicon master. Polyethylene glycol diacrylate (PEG-DA) was used as a rigiflex mold material with highly negative surface charges (zeta potential: -113.55 mW). The rigiflex, transparent PEG-DA mold spontaneously wets gold or silicon substrate via electrostatic attraction, forming reversibly bonded nanocapillaries without any surface modifications or external stimuli. Using these nanocapillaries, nanolines or nanowells were fabricated without residual layer along with one-dimensional arrays of single-walled carbon nanotubes (SWCNTs) and gold nanoparticles.
Keywords
bonding processes; gold; microfluidics; polymers; silicon; -113.55 mW; 50 to 500 nm; electrostatic attraction; electrostatic forces; gold nanoparticles; highly negative surface charges; polyethylene glycol diacrylate; reversibly bonded nanocapillaries; rigiflex mold; single-walled carbon nanotubes; Aerospace engineering; Bonding forces; Carbon nanotubes; Electrostatics; Gold; Lithography; Nanobioscience; Polyethylene; Polymers; Silicon; Reversibly bonded nanocapillaries; electrostatic forces; of single-walled carbon nanotubes (SWCNTs); rigiflex mold;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2007. NEMS '07. 2nd IEEE International Conference on
Conference_Location
Bangkok
Print_ISBN
1-4244-0610-2
Type
conf
DOI
10.1109/NEMS.2007.352161
Filename
4160464
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