• DocumentCode
    2421181
  • Title

    Reversibly bonded nanocapillaries by electrostatic forces

  • Author

    Kim, Pilnam ; Baik, Seunghyun ; Suh, Kahp Y.

  • Author_Institution
    Sch. of Mech. & Aerosp. Eng., Seoul Nat. Univ.
  • fYear
    2007
  • fDate
    16-19 Jan. 2007
  • Firstpage
    890
  • Lastpage
    894
  • Abstract
    Reversibly bonded nanocapillaries (500 - 50 nm) were fabricated on gold and silicon substrates using electrostatic forces that can be generated on a rigiflex mold upon removal from an original, engraved silicon master. Polyethylene glycol diacrylate (PEG-DA) was used as a rigiflex mold material with highly negative surface charges (zeta potential: -113.55 mW). The rigiflex, transparent PEG-DA mold spontaneously wets gold or silicon substrate via electrostatic attraction, forming reversibly bonded nanocapillaries without any surface modifications or external stimuli. Using these nanocapillaries, nanolines or nanowells were fabricated without residual layer along with one-dimensional arrays of single-walled carbon nanotubes (SWCNTs) and gold nanoparticles.
  • Keywords
    bonding processes; gold; microfluidics; polymers; silicon; -113.55 mW; 50 to 500 nm; electrostatic attraction; electrostatic forces; gold nanoparticles; highly negative surface charges; polyethylene glycol diacrylate; reversibly bonded nanocapillaries; rigiflex mold; single-walled carbon nanotubes; Aerospace engineering; Bonding forces; Carbon nanotubes; Electrostatics; Gold; Lithography; Nanobioscience; Polyethylene; Polymers; Silicon; Reversibly bonded nanocapillaries; electrostatic forces; of single-walled carbon nanotubes (SWCNTs); rigiflex mold;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2007. NEMS '07. 2nd IEEE International Conference on
  • Conference_Location
    Bangkok
  • Print_ISBN
    1-4244-0610-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2007.352161
  • Filename
    4160464