• DocumentCode
    2422583
  • Title

    Experimental validation of a tactile sensor model for a robotic hand

  • Author

    Yahud, S. ; Dokos, S. ; Morley, J.W. ; Lovell, N.H.

  • Author_Institution
    Grad. Sch. of Biomed. Eng., Univ. of New South Wales, Sydney, NSW, Australia
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    2300
  • Lastpage
    2303
  • Abstract
    We describe a tactile sensor for a robotic hand, based on the mechanoreceptors in the glabrous skin of the human hand to replicate the sensory function of both slow adapting and fast adapting receptors. Strain gauges are used for the slow adapting receptors, and polyvinylidene fluoride (PVDF) film was used to replicate the function of the fast adapting receptors. One unit sensor consisted of four strain gauges and a single PVDF film, embedded beneath a square protrusion. The protrusion helped localize the applied force onto the region or `receptive field´ of the sensing unit. Strain gauges were orientated to enable the unit sensor to identify the tri-axial force components. Multiple linear regression was used to predict the components of force. The regression model with interaction terms gave good prediction with mean percentage errors of less than 15% for each force component.
  • Keywords
    biological techniques; finite element analysis; polymer films; regression analysis; skin; strain gauges; tactile sensors; touch (physiological); fast adapting receptors; glabrous skin; human hand; mechanoreceptors; multiple linear regression; polyvinylidene fluoride film; robotic hand; single PVDF film; slow adapting receptors; strain gauges; tactile sensor; Algorithms; Biomedical Engineering; Equipment Design; Finite Element Analysis; Hand; Humans; Mechanoreceptors; Polyvinyls; Prosthesis Design; Psychomotor Performance; Regression Analysis; Robotics; Touch; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5335048
  • Filename
    5335048