DocumentCode
2422586
Title
Virtual Operation of MEMS Devices Based on FEM Simulation
Author
Zhao, Xin ; Wang, Lei ; Wang, Kai ; Lu, Guizhang
Author_Institution
Inst. of Robotics & Autom. Inf. Syst., Nankai Univ., Tianjin
fYear
2007
fDate
16-19 Jan. 2007
Firstpage
122
Lastpage
126
Abstract
This paper presents the virtual operation of typical MEMS devices based on finite element method (FEM). The model implemented in the virtual environment which simulates the kinematics of MEMS device is constructed from the result of finite element analysis (FEA). According to linear finite element computation theory, extensive linear characteristic will be introduced in the paper. This characteristic can be utilized in the modeling procedure of MEMS devices by using polynomial fit of FEA result. Order and parameter identification of polynomial fit are required. Due to the extensive linear characteristic, linear coefficients are found in the polynomial fit expressions which capture most of the accuracy and flexibility of kinematical behavior of MEMS device. Also the general virtual operation system which simulates the mechanical behavior of some typical MEMS device using virtual reality technology has been proposed. Kinematical model based on FEM simulation has been developed and successively implemented in the virtual environment.
Keywords
curve fitting; finite element analysis; kinematics; micromechanical devices; virtual reality; FEM simulation; MEMS devices; extensive linear characteristic; finite element method; kinematical behavior; mechanical behavior; order identification; parameter identification; polynomial fit; virtual operation; virtual reality; Analytical models; Computation theory; Computational modeling; Finite element methods; Kinematics; Microelectromechanical devices; Parameter estimation; Polynomials; Virtual environment; Virtual reality; FEM; MEMS; extensive linear characteristic; virtual operation;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2007. NEMS '07. 2nd IEEE International Conference on
Conference_Location
Bangkok
Print_ISBN
1-4244-0610-2
Type
conf
DOI
10.1109/NEMS.2007.352244
Filename
4160547
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