• DocumentCode
    2424516
  • Title

    How imperfections in mica tape barriers influence tree growth and breakdown time

  • Author

    Vogelsang, R. ; Brütsch, R. ; Frö, K.

  • Author_Institution
    High Voltage Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland
  • fYear
    2003
  • fDate
    19-22 Oct. 2003
  • Firstpage
    657
  • Lastpage
    660
  • Abstract
    The propagation of electrical trees in bended sections of mica tapes is described. The investigations have been made because tapes in coil insulations of high voltage rotating machines cannot always be wound in a perfectly even manner. The tapes are bended at the coil edges, at places where tapes overlap or due to the taping- and manufacturing process. Possible tape bends were therefore analysed by taking micrographs of industrially made model bars. To investigate the influence on time to breakdown, treeing experiments in needle-plane specimens with barriers of bended and unbended mica tapes were made. The results show that the tree can penetrate the tape below a certain bending radius, which depends on the tape material. Tree growth through a bended tape can lead to a significantly shorter time to breakdown. The results can be used for manufacturers to specify the minimum allowable tape bending and therefore assure a higher quality of the mica insulation. The results provide also a basis for development of tape materials with a lower sensitivity to damage at regions of tape bending.
  • Keywords
    bending; coils; electric breakdown; insulating coatings; mica; trees (electrical); bended sections; breakdown time; coil edges; coil insulations; high voltage rotating machines; imperfections; manufacturing process; mica tape barriers; needle-plane specimens; tape bends; taping process; time to breakdown; tree growth; treeing experiments; Bars; Coils; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Manufacturing industries; Manufacturing processes; Rotating machines; Trees - insulation; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2003. Annual Report. Conference on
  • Print_ISBN
    0-7803-7910-1
  • Type

    conf

  • DOI
    10.1109/CEIDP.2003.1254940
  • Filename
    1254940