DocumentCode
2427788
Title
Inductance aware interconnect scaling
Author
Banerjee, Kaustav ; Mehrotra, Amit
Author_Institution
Center for Integrated Syst., Stanford Univ., CA, USA
fYear
2002
fDate
2002
Firstpage
43
Lastpage
47
Abstract
This paper introduces a new global-tier interconnect scaling scheme which ensures that inductance effects do not start dominating the overall interconnect performance. It is shown that for unscaled global lines, inductance effects increase as technology scales while for the scaling scheme proposed by ITRS (1999), interconnects become extremely resistive and, while inductance effects diminish with scaling but the performance, specifically, delay per unit length, degrades with scaling. The effect of the proposed global interconnect scaling scheme on optimized driver size, interconnect length, delay per unit length and total buffer area is quantified and compared with the unscaled and the ITRS cases. It is shown that the proposed scaling scheme improves the delay per unit length without degrading inductive effects or increasing buffer area with scaling.
Keywords
inductance; integrated circuit design; integrated circuit interconnections; ITRS scaling scheme; delay per unit length; global interconnect scaling scheme; global-tier interconnect scaling scheme; inductance aware interconnect scaling; inductance effects; interconnect length; interconnect performance; optimized driver size; resistive interconnects; technology scaling; total buffer area; unscaled global lines; Copper; Degradation; Delay effects; Impedance; Inductance; Integrated circuit interconnections; Mutual coupling; Parasitic capacitance; Repeaters; Transfer functions;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2002. Proceedings. International Symposium on
Print_ISBN
0-7695-1561-4
Type
conf
DOI
10.1109/ISQED.2002.996689
Filename
996689
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