• DocumentCode
    2431176
  • Title

    Modeling and improving heat dissipation from large aluminum electrolytic capacitors

  • Author

    Stevens, J.L. ; Sauer, J.D. ; Shaffer, J.S.

  • Author_Institution
    Philips Components, Columbia, SC, USA
  • Volume
    3
  • fYear
    1996
  • fDate
    6-10 Oct 1996
  • Firstpage
    1343
  • Abstract
    Thermal models for large can aluminum electrolytic capacitors have existed for a number of years for screw terminal products. These models have various shortcomings in their ability to handle the effects of package size, roll diameter and the mechanical details of assembly. An improved model was introduced recently which more accurately accounts for these internal parameters. This paper extends the use of that model to improved constructions which allow much more ripple current with no more internal heating than standard capacitors. An approximate empirical relationship has been developed to estimate conduction of heat from the roll to the terminals. In addition, the external environment of the capacitor has been considered since dissipation of heat necessarily involves transfer of the energy away from the capacitor. Studies have been conducted on the effect of air flow on the package-to-ambient thermal resistance. The use of external heat sinking is shown to be effective, especially when air flow is available and the heat sinks are integrated with the capacitor package to minimize the thermal resistances in the heat flow path. In these cases, the external thermal resistances can be reduced by more than 50%
  • Keywords
    aluminium; cooling; electrolytic capacitors; heat sinks; power electronics; thermal analysis; thermal resistance; Al; air flow; electrolytic capacitors; empirical relationship; external heat sinking; heat conduction; heat dissipation; internal parameters; package-to-ambient thermal resistance; power electronics; ripple current; thermal models; Aluminum; Assembly; Capacitors; Fasteners; Heat sinks; Heat transfer; Packaging; Resistance heating; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Conference, 1996. Thirty-First IAS Annual Meeting, IAS '96., Conference Record of the 1996 IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    0197-2618
  • Print_ISBN
    0-7803-3544-9
  • Type

    conf

  • DOI
    10.1109/IAS.1996.559240
  • Filename
    559240