• DocumentCode
    2434147
  • Title

    Yield-oriented evaluation methodology of network-on-chip routing implementations

  • Author

    Rodrigo, S. ; Hernández, C. ; Flich, J. ; Silla, F. ; Duato, J. ; Medardoni, S. ; Bertozzi, D. ; Mejía, A. ; Dai, D.

  • Author_Institution
    Parallel Archit. Group, Univ. Politec. de Valencia, Valencia, Spain
  • fYear
    2009
  • fDate
    5-7 Oct. 2009
  • Firstpage
    100
  • Lastpage
    105
  • Abstract
    Network-on-Chip technology is gaining wide popularity for the interconnection of an increasing number of processor cores on the same silicon die. However, growing process variations cause interconnect malfunction or prevent the network from working at the intended frequency, directly impacting yield and manufacturing cost. Topology agnostic routing algorithms have the potential to tolerate process variations without degrading performance. We propose a three step methodology for evaluating routing algorithms in their ability to deal with variability. Using yield enhancement and operation speed preservation as the criteria, we demonstrate how this methodology can be used to select the best design choice among several plausible combinations of routing algorithms and implementations. Also, we show how an efficient table-less routing implementation can be used to minimise the impact of variability on manufacturing and operating frequency.
  • Keywords
    integrated circuit interconnections; integrated circuit yield; microprocessor chips; network-on-chip; silicon; Si; interconnect malfunction; network-on-chip routing; processor core interconnection; silicon die; yield enhancement; yield operation; yield oriented evaluation; Costs; Fault tolerance; Frequency; Logic; Manufacturing processes; Network-on-a-chip; Parallel architectures; Routing; Silicon; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System-on-Chip, 2009. SOC 2009. International Symposium on
  • Conference_Location
    Tampere
  • Print_ISBN
    978-1-4244-4465-6
  • Electronic_ISBN
    978-1-4244-4467-0
  • Type

    conf

  • DOI
    10.1109/SOCC.2009.5335667
  • Filename
    5335667