DocumentCode
2434767
Title
Microelectronics technology and packaging [breaker page]
fYear
2012
fDate
24-26 May 2012
Firstpage
405
Lastpage
406
Abstract
Start of the Microelectronics technology and packaging section.
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed Design of Integrated Circuits and Systems (MIXDES), 2012 Proceedings of the 19th International Conference
Conference_Location
Warsaw, Poland
Print_ISBN
978-1-4577-2092-5
Type
conf
Filename
6226297
Link To Document