Standardization of wafer level reliability techniques-JEDEC 14.2

Summary form only given. JEDEC stands for: Joint Electronic Device Engineering Council and is sometimes known as simply “The Council”, and is the engineering standardization body ofthe Electronic Industry Association (EIA). Promoting development and standardization of test methods, nomenclature and product characterization are primary functions of the Council. The Council establishes Committees to conduct its standardization activities, with the primary function of each Committee being to propose standards, procedures, etc., and submit them to the Council for action or approval. Reliability is handled by JEDEC Committee 14 (JC 14) “Committee on Quality and Reliability of Solid State Products”. As its title implies JC 14 is responsible for generation and maintenance of quality and reliability standards for solid state products. Currently there are seven active JC 14 subcommittees, one of which is JC 14.2, whose scope includes generation of terms, definitions and establishment and/or review of specifications and standards relating to wafer level assessment of semiconductor devices. This committee also provides a forum for discussion of wafer level reliability assessment of all types. Most methods, techniques and standards developed for wafer level assessment work equally well with packaged devices