DocumentCode
2439059
Title
Issues of designing basic structures and components of microwave IC modules
Author
Babunko, S.A. ; Orlov, O.S.
fYear
2003
fDate
8-12 Sept. 2003
Firstpage
586
Lastpage
588
Abstract
The issues of developing multipurpose basic structures and components for hybrid microwave IC modules are considered. Physics-related, technical and economic problems and limitations are discussed. Examples of IC component design are listed, outlook for this technology is reviewed.
Keywords
hybrid integrated circuits; integrated circuit design; microwave integrated circuits; millimetre wave integrated circuits; monolithic integrated circuits; economic problem; hybrid microwave IC module; integrated circuit; multipurpose basic structures; IEEE catalog; Microwave integrated circuits; Microwave technology; Organizing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave and Telecommunication Technology, 2003. CriMiCo 2003. 13th International Crimean Conference
Conference_Location
Sevastopol, Crimea, Ukraine
Print_ISBN
966-7968-26-X
Type
conf
DOI
10.1109/CRMICO.2003.158945
Filename
1256631
Link To Document