• DocumentCode
    243937
  • Title

    Buffering Single-Walled Carbon Nanotubes Bundle Interconnects for Timing Optimization

  • Author

    Lin Liu ; Yuchen Zhou ; Shiyan Hu

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Michigan Technol. Univ., Houghton, MI, USA
  • fYear
    2014
  • fDate
    9-11 July 2014
  • Firstpage
    362
  • Lastpage
    367
  • Abstract
    As prevailing copper interconnect technology advances to its fundamental physical limit, interconnect delay due to ever-increasing wire resistivity has greatly limited the circuit miniaturization. Single-walled carbon nanotubes (SWCNTs) bundle interconnects have emerged as a promising replacement material for copper interconnects due to their superior conductivity. Previous works have focused on studying device and interconnect modeling for bundled SWCNTs while none of them consider deployment of such an advanced technology into VLSI physical design. To the best of the authors´ knowledge, this paper develops the first physical design technique for the interconnect optimization using carbon nanotube interconnects. We propose a timing driven buffer insertion technique for bundled SWCNTs, where the standard buffering algorithm has been enhanced to accommodate some features in the SWCNT timing modelling. Our experimental results on a set of scaled industrial nets at 22nm technology demonstrate that compared to copper buffering, CNT buffering can save over 50% buffer area with the same timing constraint. In addition, CNT buffering can effectively reduce the delay by up to 32%. Further, CNT buffering runs in time similar to copper buffering.
  • Keywords
    buffer layers; carbon nanotubes; integrated circuit interconnections; optimisation; C; buffering; physical design technique; single-walled carbon nanotubes bundle interconnects; size 22 nm; timing driven buffer insertion technique; timing optimization; Copper; Delays; Integrated circuit interconnections; Quantum capacitance; Resistance; Buffer Insertion; Bundled SWCNTs; Carbon Nanotube; Interconnect Optimization; Timing Optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI (ISVLSI), 2014 IEEE Computer Society Annual Symposium on
  • Conference_Location
    Tampa, FL
  • Print_ISBN
    978-1-4799-3763-9
  • Type

    conf

  • DOI
    10.1109/ISVLSI.2014.35
  • Filename
    6903390