DocumentCode
2441357
Title
Pitfalls when correlating TLP, HBM and MM testing
Author
Notermans, Guido ; De Jong, Peter ; Kuper, Fred
Author_Institution
Philips Semicond., Nijmegen, Netherlands
fYear
1998
fDate
6-8 Oct. 1998
Firstpage
170
Lastpage
176
Abstract
Correlation between human body model (HBM), machine model (MM) and transmission line pulse (TLP) testing is still under discussion. In this paper, it is shown that the lack of correlation is due to misinterpretations in the test results, due to the fact that soft and hard failures are often confused. This is illustrated by ESD results of test structures with grounded-gate NMOSTs and field oxide devices, measured according to HBM, MM and by means of TLP testing. It is shown that for a valid comparison, it is essential to combine electrical measurements with a thorough physical failure analysis in order to establish the failure signature. Once the failure signature and the current path are taken into account, a good correlation is found.
Keywords
MOSFET; dielectric thin films; electrostatic discharge; failure analysis; integrated circuit reliability; integrated circuit testing; semiconductor device breakdown; transmission line theory; ESD test structures; HBM testing; MM testing; SiO/sub 2/-Si; TLP testing; correlation; current path; electrical measurements; failure signature; field oxide devices; grounded-gate NMOSTs; hard failures; human body model testing; machine model testing; physical failure analysis; soft failures; test result misinterpretation; transmission line pulse testing; Biological system modeling; Electric variables measurement; Electrostatic discharge; Failure analysis; Humans; Performance evaluation; Pulse measurements; System testing; Transmission line measurements; Transmission line theory;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium Proceedings, 1998
Conference_Location
Reno, NV, USA
Print_ISBN
1-878303-91-0
Type
conf
DOI
10.1109/EOSESD.1998.737036
Filename
737036
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