• DocumentCode
    2441357
  • Title

    Pitfalls when correlating TLP, HBM and MM testing

  • Author

    Notermans, Guido ; De Jong, Peter ; Kuper, Fred

  • Author_Institution
    Philips Semicond., Nijmegen, Netherlands
  • fYear
    1998
  • fDate
    6-8 Oct. 1998
  • Firstpage
    170
  • Lastpage
    176
  • Abstract
    Correlation between human body model (HBM), machine model (MM) and transmission line pulse (TLP) testing is still under discussion. In this paper, it is shown that the lack of correlation is due to misinterpretations in the test results, due to the fact that soft and hard failures are often confused. This is illustrated by ESD results of test structures with grounded-gate NMOSTs and field oxide devices, measured according to HBM, MM and by means of TLP testing. It is shown that for a valid comparison, it is essential to combine electrical measurements with a thorough physical failure analysis in order to establish the failure signature. Once the failure signature and the current path are taken into account, a good correlation is found.
  • Keywords
    MOSFET; dielectric thin films; electrostatic discharge; failure analysis; integrated circuit reliability; integrated circuit testing; semiconductor device breakdown; transmission line theory; ESD test structures; HBM testing; MM testing; SiO/sub 2/-Si; TLP testing; correlation; current path; electrical measurements; failure signature; field oxide devices; grounded-gate NMOSTs; hard failures; human body model testing; machine model testing; physical failure analysis; soft failures; test result misinterpretation; transmission line pulse testing; Biological system modeling; Electric variables measurement; Electrostatic discharge; Failure analysis; Humans; Performance evaluation; Pulse measurements; System testing; Transmission line measurements; Transmission line theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium Proceedings, 1998
  • Conference_Location
    Reno, NV, USA
  • Print_ISBN
    1-878303-91-0
  • Type

    conf

  • DOI
    10.1109/EOSESD.1998.737036
  • Filename
    737036