DocumentCode
2441760
Title
Effects of gas phase absorption into Si substrates on plasma doping process
Author
Higaki, Ryota ; Tsutsui, Kazuo ; Sasaki, Yuichiro ; Akama, Sadahiro ; Mizuno, Bunji ; Ohmi, Shunichiro ; Iwai, Hiroshi
Author_Institution
Dept. of Adv. Appl. Electron., Tokyo Inst. of Technol., Yokohama, Japan
fYear
2003
fDate
16-18 Sept. 2003
Firstpage
231
Lastpage
234
Abstract
In the low energy plasma doping process, the contribution of not only ionised species but also neutral species to the doping process should be considered. In order to investigate such a contribution, experiments of gas phase doping combined with Ar plasma pre-treatment were carried out. Gas phase impurity absorption should be affected by the Si crystalline disorder caused by the plasma doping. Ar plasma was used to simulate this effect. As a result, significant increase of boron dose from the neutral gas phase was observed when the substrate surface was pre-treated by Ar plasma prior to exposure to neutral B/sub 2/H/sub 6//He gas. The boron was considered to be absorbed in the amorphous layer. Understanding and control of this phenomenon are important for plasma doping technology, in which ion irradiation and absorption of neutral species proceed simultaneously.
Keywords
adsorption; argon; boron compounds; doping profiles; elemental semiconductors; helium; plasma immersion ion implantation; semiconductor doping; silicon; Ar; Ar plasma surface pre-treatment; B/sub 2/H/sub 6/; He; Si; Si crystalline disorder; Si substrates; amorphous layer; boron dose; gas phase doping; gas phase impurity absorption; ion irradiation; ionised species; low energy plasma doping process; neutral gas phase; neutral species absorption; Absorption; Argon; Doping; Helium; Impurities; Plasma chemistry; Plasma immersion ion implantation; Plasma simulation; Plasma sources; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
European Solid-State Device Research, 2003. ESSDERC '03. 33rd Conference on
Conference_Location
Estoril, Portugal
Print_ISBN
0-7803-7999-3
Type
conf
DOI
10.1109/ESSDERC.2003.1256856
Filename
1256856
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