• DocumentCode
    2452459
  • Title

    Poly(ether-imide) thin films with/without fluorine in the structure

  • Author

    Hamciuc, Elena ; Hamciuc, Corneliu ; Bacosca, Irina ; Cazacu, Maria

  • Author_Institution
    Petru Poni Inst. of Macromolecular Chem., Iasi, Romania
  • Volume
    2
  • fYear
    2009
  • fDate
    12-14 Oct. 2009
  • Firstpage
    367
  • Lastpage
    370
  • Abstract
    Thin films, in the range of tens of micrometers thickness, have been prepared by casting onto glass plates the N-methylpyrrolidone solutions of two poly(ether imide)s containing isopropylidene or hexafluoroisopropylidene groups. The polymers have been synthesized by polycondensation reaction of 4,4´-(1,3-phenylenedioxy) dianiline, with 2,2-bis[(3,4-dicarboxyphenoxy) phenyl] propane dianhydride or 1,1,1,3,3,3-hexafluoro-2,2-bis [(3,4-dicarboxyphenoxy) phenyl]propane dianhydride. They were easily soluble in polar aprotic solvents and showed high thermal stability. The surface properties of the poly(ether imide) thin films such as dynamic contact angles, contact angle hysteresis, and water vapours sorption capacity were evaluated in correlation with their structure. The dielectric spectroscopy in the frequency range of 10-1-106 Hz and at temperature range from 100degC to 175degC was employed to study the electrical behaviour of polymer films.
  • Keywords
    casting; contact angle; dielectric losses; liquid phase deposition; permittivity; polymer films; polymerisation; solubility; sorption; thermal stability; thin films; 1,1,1,3,3,3-hexafluoro-2,2-bis [(3,4-dicarboxyphenoxy) phenyl]propane dianhydride; 2,2-bis[(3,4-dicarboxyphenoxy) phenyl] propane dianhydride; 4,4´-(1,3-phenylenedioxy) dianiline; N-methylpyrrolidone solutions; contact angle hysteresis; dielectric constant; dielectric loss; dielectric spectroscopy; dynamic contact angles; electrical behaviour; fluorine; frequency 1.0 Hz to 10000000 Hz; hexafluoroisopropylidene groups; polar aprotic solvents; poly(ether-imide) thin film synthesis; polycondensation reaction; polymer films; solubility; solution casting technique; surface property; temperature 100 C to 175 C; thermal stability; water vapour sorption capacity; Casting; Contacts; Dielectric thin films; Glass; Hysteresis; Polymer films; Solvents; Thermal stability; Transistors; Water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference, 2009. CAS 2009. International
  • Conference_Location
    Sinaia
  • ISSN
    1545-827X
  • Print_ISBN
    978-1-4244-4413-7
  • Type

    conf

  • DOI
    10.1109/SMICND.2009.5336705
  • Filename
    5336705