Structural planning of 3D-IC interconnects by block alignment

Three-dimensional integrated circuits rely on optimized interconnect structures for blocks which are spread among one or multiple dies. We demonstrate how 2D and 3D block alignment can be efficiently utilized for structural planning of different interconnects. To realize this, we extend the corner block list and provide effective techniques for 3D layout generation, i.e., block placement and alignment. Our techniques are made available in an open-source, simulated-annealing-based tool. Besides block alignment, it accounts for key objectives in 3D design like fast thermal management and fixed-outline floorplanning. Experimental results on GSRC and IBM-HB+ circuits demonstrate the capabilities of our tool for both planning 3D-IC interconnects by block alignment and for 3D floorplanning in general.