• DocumentCode
    2453614
  • Title

    Multi-bit Error Tolerant Caches Using Two-Dimensional Error Coding

  • Author

    Kim, Jangwoo ; Hardavellas, Nikos ; Mai, Ken ; Falsafi, Babak ; Hoe, James C.

  • Author_Institution
    Carnegie Mellon Univ., Pittsburgh
  • fYear
    2007
  • fDate
    1-5 Dec. 2007
  • Firstpage
    197
  • Lastpage
    209
  • Abstract
    In deep sub-micron ICs, growing amounts of on-die memory and scaling effects make embedded memories increasingly vulnerable to reliability and yield problems. As scaling progresses, soft and hard errors in the memory system will increase and single error events are more likely to cause large-scale multi- bit errors. However, conventional memory protection techniques can neither detect nor correct large-scale multi-bit errors without incurring large performance, area, and power overheads. We propose two-dimensional (2D) error coding in embedded memories, a scalable multi-bit error protection technique to improve memory reliability and yield. The key innovation is the use of vertical error coding across words that is used only for error correction in combination with conventional per-word horizontal error coding. We evaluate this scheme in the cache hierarchies of two representative chip multiprocessor designs and show that 2D error coding can correct clustered errors up to 32times32 bits with significantly smaller performance, area, and power overheads than conventional techniques.
  • Keywords
    cache storage; circuit reliability; error correction codes; 2D error coding; error correction; large-scale multibit errors; memory protection techniques; memory reliability; memory system; multibit error tolerant caches; on-die memory; scaling effects; two-dimensional error coding; Computer errors; Error correction; Error correction codes; Hamming distance; Large-scale systems; Manufacturing; Power system protection; Power system reliability; Random access memory; Runtime;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microarchitecture, 2007. MICRO 2007. 40th Annual IEEE/ACM International Symposium on
  • Conference_Location
    Chicago, IL
  • ISSN
    1072-4451
  • Print_ISBN
    978-0-7695-3047-5
  • Electronic_ISBN
    1072-4451
  • Type

    conf

  • DOI
    10.1109/MICRO.2007.19
  • Filename
    4408256