• DocumentCode
    2453956
  • Title

    Improving the reliability of embedded systems with cache and SPM

  • Author

    Wang, Meng ; Wang, Yi ; Liu, Duo ; Shao, Zili

  • Author_Institution
    Dept. of Comput., Hong Kong Polytech. Univ., Kowloon, China
  • fYear
    2009
  • fDate
    12-15 Oct. 2009
  • Firstpage
    825
  • Lastpage
    830
  • Abstract
    In this paper, we develop a compiler-assisted thermal-aware data allocation algorithm to improve the reliability of embedded systems with cache and SPM (scratch-pad memory). Our basic idea is to distribute the workload evenly between the cache and SPM in order to alleviate the temperature hot spots in the on-chip memory system. In the algorithm, considering the size of SPM, we first divide the loop iterations into two parts, and put the accessed data of the first part into SPM. Then we perform code transformation based on the partitioning of iterations. By alternatively using the data cache and SPM, the peak temperature is reduced. We implement our technique and simulate them using the Trimaran infrastructure with power models for cache and SPM, and the thermal simulator, HotSpot, on a set of benchmarks from DSPstone and MiBench. The experimental results show that our technique can significantly improve the reliability of the on-chip memory system.
  • Keywords
    cache storage; digital storage; embedded systems; program compilers; DSPstone; MiBench; SPM; Trimaran infrastructure; code transformation; compiler-assisted thermal-aware data allocation algorithm; data cache; embedded systems; on-chip memory system; reliability; scratch-pad memory; thermal simulator HotSpot; Delay; Embedded system; Energy consumption; Hardware; Partitioning algorithms; Power system modeling; Power system reliability; Scanning probe microscopy; System-on-a-chip; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mobile Adhoc and Sensor Systems, 2009. MASS '09. IEEE 6th International Conference on
  • Conference_Location
    Macau
  • Print_ISBN
    978-1-4244-5113-5
  • Type

    conf

  • DOI
    10.1109/MOBHOC.2009.5336913
  • Filename
    5336913