DocumentCode
2453956
Title
Improving the reliability of embedded systems with cache and SPM
Author
Wang, Meng ; Wang, Yi ; Liu, Duo ; Shao, Zili
Author_Institution
Dept. of Comput., Hong Kong Polytech. Univ., Kowloon, China
fYear
2009
fDate
12-15 Oct. 2009
Firstpage
825
Lastpage
830
Abstract
In this paper, we develop a compiler-assisted thermal-aware data allocation algorithm to improve the reliability of embedded systems with cache and SPM (scratch-pad memory). Our basic idea is to distribute the workload evenly between the cache and SPM in order to alleviate the temperature hot spots in the on-chip memory system. In the algorithm, considering the size of SPM, we first divide the loop iterations into two parts, and put the accessed data of the first part into SPM. Then we perform code transformation based on the partitioning of iterations. By alternatively using the data cache and SPM, the peak temperature is reduced. We implement our technique and simulate them using the Trimaran infrastructure with power models for cache and SPM, and the thermal simulator, HotSpot, on a set of benchmarks from DSPstone and MiBench. The experimental results show that our technique can significantly improve the reliability of the on-chip memory system.
Keywords
cache storage; digital storage; embedded systems; program compilers; DSPstone; MiBench; SPM; Trimaran infrastructure; code transformation; compiler-assisted thermal-aware data allocation algorithm; data cache; embedded systems; on-chip memory system; reliability; scratch-pad memory; thermal simulator HotSpot; Delay; Embedded system; Energy consumption; Hardware; Partitioning algorithms; Power system modeling; Power system reliability; Scanning probe microscopy; System-on-a-chip; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Mobile Adhoc and Sensor Systems, 2009. MASS '09. IEEE 6th International Conference on
Conference_Location
Macau
Print_ISBN
978-1-4244-5113-5
Type
conf
DOI
10.1109/MOBHOC.2009.5336913
Filename
5336913
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