• DocumentCode
    245493
  • Title

    Multipath Routing Protocol Based on Congestion Control Mechanism Implemented by Cross-Layer Design Concept for WSN

  • Author

    Qian Peng ; Dong Enqing ; Xu Juan ; Lan Xing ; Liu Wei ; Cui Wentao

  • Author_Institution
    Sch. of Mech., Shandong Univ., Weihai, China
  • fYear
    2014
  • fDate
    19-21 Dec. 2014
  • Firstpage
    378
  • Lastpage
    384
  • Abstract
    To solve the problem of congestion which often occurs in the process of the large data transmission in large-scale wireless senator networks, a multipath routing protocol based on congestion control mechanism implemented by cross-layer design concept is proposed. Realizing the multipath routing protocol on the basis of AODV protocol, congestion control mechanism with active congestion avoidance, real-time detection and alleviative congestion is implemented by applying interaction information of cross-layer design between MAC layer and Routing layer. The simulation results show that the proposed multipath routing protocol with congestion control mechanism has some advantages in packet delivery ratio, end-to-end delay and normalized overheads. The proposed protocol can ensure the reliability and validity of service, and save energy consumption to prolong the working lifetime of wireless sensor networks.
  • Keywords
    routing protocols; telecommunication congestion control; wireless sensor networks; AODV protocol; MAC layer; WSN; active congestion avoidance; ad hoc on-demand distance vector protocol; alleviative congestion; congestion control mechanism; cross-layer design concept; end-to-end delay; interaction information; multipath routing protocol; normalized overhead; packet delivery ratio; wireless sensor network; Data communication; Maintenance engineering; Reliability; Routing; Routing protocols; Wireless sensor networks; Wireless Sensor Networks; congestion control; cross-layer design; multipath routing protocol;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Science and Engineering (CSE), 2014 IEEE 17th International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4799-7980-6
  • Type

    conf

  • DOI
    10.1109/CSE.2014.98
  • Filename
    7023608