Nano copper wires interconnection for three — dimensional integration in power electronics

This paper presents a process of making a solder-less element for mechanical and electrical interconnection using copper nano wires. It consists in a structure of nano-posts, which are deposited on two different metal surfaces by copper electroplating through a porous alumina membrane. Electrical and mechanical interconnection is then achieved by pressing the surfaces against each other leading to the permeation and the entanglement of the nanowires. This low temperature process allows saving energy and is a very promising candidate to favor three-dimensional integration in power electronics.