Modified pulse arc deposition for reducing of droplet emission

Author

Keutel, K. ; Fuchs, H. ; Mecke, H. ; Edelmann, Ch.

Author_Institution

Otto-von-Guericke-Univ., Magdeburg, Germany

Volume

2

fYear

1998

fDate

17-21 Aug 1998

Firstpage

562

Abstract

The droplet emission in a modified pulse arc process was investigated in relation to the DC random arc process. Nitride coatings were deposited on surfaces of stainless steel and of polished high speed steel. Ti, Cr and TiB (96:4 at%) were inserted in the deposition arrangement as target materials. The special melting points of these target materials makes a different behavior of the cathodic arc discharge possible. The deposited layers were analysed on the droplet number, droplet size and droplet shape. Furthermore the surface roughness was measured. The structure and the stoichiometry were tested. It was found that the modified pulse arc deposition reduces the droplet emission. By using the modified pulse arc process, the surface roughness of TiN decreases about 20% in comparison to DC mode deposited TiN layers. The modified pulse arc process has no influence on layer structure and layer composition

Keywords

arcs (electric); cathodes; drops; titanium compounds; vapour deposited coatings; vapour deposition; DC random arc process; TiN; cathodic arc discharge; droplet emission reduction; droplet number; droplet shape; droplet size; layer composition; layer structure; melting points; modified pulse arc deposition; physical vapour deposition; surface roughness; target materials; Arc discharges; Chromium; Coatings; Rough surfaces; Shape; Steel; Surface discharges; Surface roughness; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Discharges and Electrical Insulation in Vacuum, 1998. Proceedings ISDEIV. XVIIIth International Symposium on

Conference_Location

Eindhoven

ISSN

1093-2941

Print_ISBN

0-7803-3953-3

Type

conf

DOI

10.1109/DEIV.1998.738720

Filename

738720