DocumentCode
2465959
Title
Evaluation of aluminum nitride based RF lossy dielectrics for use in high power microwave devices
Author
Kirshner, Mark F. ; Turek, Ladislav ; Pekrul, Elissa
Author_Institution
Northrop Grumman Electron. Syst., San Carlos, CA, USA
fYear
2002
fDate
2002
Firstpage
36
Lastpage
37
Abstract
Summary form only given. For the past three years, new aluminum nitride (AlN) based ceramics have been under development to replace a hot-pressed ceramic composition made from beryllia (BeO) and silicon carbide (SiC). The BeO-SiC composite is currently the material-of-choice to provide RF loss and high thermal conductivity within the vacuum envelopes of microwave tubes. However, increasingly stringent BeO health and safety regulations and liability issues have caused qualified domestic manufacturers to cease production. Experimental evaluation of the new AlN materials in specific microwave tube configurations is being carried out. Loss buttons of the new materials are fabricated and diffusion bonded into S-band klystron cavities for cold testing. The loaded cavity Q´s and frequencies are compared to those obtained with buttons made from the standard BeO-SiC composition. Materials that exhibit RF behavior similar to BeO-SiC are then selected for high-power testing at X-band to determine their suitability for use in the severe environmental conditions existing inside a high power microwave tube.
Keywords
Q-factor; absorbing media; aluminium compounds; ceramics; dielectric materials; klystrons; microwave materials; microwave tubes; permittivity; thermal conductivity; AlN; AlN based ceramics; BeO-SiC; BeO-SiC composites; RF loss; S-band klystron cavities; X-band high-power testing; aluminum nitride based RF lossy dielectrics; beryllia; cold testing; diffusion bonding; environmental operating conditions; health and safety regulations; high-power microwave devices; hot-pressed ceramic compositions; loaded cavity Q; loaded cavity frequency; loss buttons; microwave tubes; silicon carbide; thermal conductivity; vacuum envelopes; Aluminum nitride; Ceramics; Conducting materials; Dielectric devices; Dielectric losses; Materials testing; Microwave devices; Radio frequency; Silicon carbide; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference, 2002. IVEC 2002. Third IEEE International
Print_ISBN
0-7803-7256-5
Type
conf
DOI
10.1109/IVELEC.2002.999247
Filename
999247
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