• DocumentCode
    2466446
  • Title

    Multipath reversed nested Miller compensation with voltage buffer for low-power three-stage amplifiers

  • Author

    Yan, Zushu

  • Author_Institution
    Beijing Microelectron. Technol. Inst., Beijing
  • fYear
    2008
  • fDate
    8-10 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A multipath reversed nested Miller compensation (MRNMC) scheme with voltage buffer (MRNMCVB) is presented in this paper. By using an efficient voltage buffer, a low-voltage, low-power, three-stage RNMC amplifier topology suitable for large capacitive load applications is constructed with a noninverting intermediate stage. Moreover, the internal feedback loop introduced by the buffer prevents the reduction in high-frequency gain and extends the bandwidth of the amplifier significantly. Furthermore, a multipath feedforward stage is added to generate a left-half-plane (LHP) zero, which improves the stability of the amplifier and reduces the size of compensation capacitors simultaneously. An optimized MRNMCVB amplifier has been implemented in a 0.35-mum CMOS process. The amplifier driving a 500-pF load capacitor achieves 1.76-MHz unity-gain frequency (UGF), 59deg phase margin, and 0.88-V/mus average slew rate, while dissipating only 45-muW power at a 1.5-V supply. The total capacitor value is just 2.92-pF.
  • Keywords
    amplifiers; capacitors; capacitor; compensation capacitors; internal feedback loop; left-half-plane zero; low-power three-stage amplifiers; multipath reversed nested Miller compensation; phase margin; unity-gain frequency; voltage buffer; Bandwidth; CMOS technology; Capacitors; Feedback loop; Frequency; Resistors; Stability; Topology; Transconductance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2008. EDSSC 2008. IEEE International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-2539-6
  • Electronic_ISBN
    978-1-4244-2540-2
  • Type

    conf

  • DOI
    10.1109/EDSSC.2008.4760676
  • Filename
    4760676