• DocumentCode
    2468386
  • Title

    Visibility enhancement for silicon debug

  • Author

    Hsu, Yu-Chin ; Tsai, Furshing ; Jong, Wells ; Chang, Ying-Tsai

  • Author_Institution
    Novas Software, San Jose, CA
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    13
  • Lastpage
    18
  • Abstract
    Several emerging design-for-debug (DFD) methodologies are addressing silicon debug by making internal signal values and other data observable. Most of these methodologies require the instrumentation of on-chip logic for extracting the internal register data from in situ silicon. Unfortunately, lack of visibility of the combinational network values impedes the ability to functionally debug the silicon part. Visibility enhancement techniques enable the virtual observation of combinational nodes with minimal computational overhead. These techniques also cover the register selection analysis for DFD and multi-level design abstraction correlation for viewing values at the register transfer level (RTL). Experimental results show that visibility enhancement techniques can leverage a small amount of extracted data to provide a high amount of computed combinational signal data. Visibility enhancement provides the needed connection between data obtained from the DFD logic and HDL simulation-related debug systems
  • Keywords
    combinational circuits; design for testability; logic design; logic testing; HDL simulation-related debug systems; combinational network; combinational nodes; design-for-debug; internal register data; multilevel design abstraction correlation; on-chip logic; register selection analysis; register transfer level; silicon debug; visibility enhancement; Data mining; Design for disassembly; Design methodology; Hardware design languages; Impedance; Instruments; Logic; Registers; Signal design; Silicon; Functional verification; IC Design; Silicon Debug; Silicon validation; Verification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2006 43rd ACM/IEEE
  • Conference_Location
    San Francisco, CA
  • ISSN
    0738-100X
  • Print_ISBN
    1-59593-381-6
  • Type

    conf

  • DOI
    10.1109/DAC.2006.238670
  • Filename
    1688752