DocumentCode
2470705
Title
Leakage power reduction of embedded memories on FPGAs through location assignment
Author
Meng, Yan ; Sherwood, Timothy ; Kastner, Ryan
Author_Institution
California Univ., Santa Barbara, CA
fYear
0
fDate
0-0 0
Firstpage
612
Lastpage
617
Abstract
Transistor leakage is poised to become the dominant source of power dissipation in digital systems, and reconfigurable devices are not immune to this problem. Modern FPGAs already have a significant amount of memory on the die, and with each generation the proportion of embedded memory to logic cells is growing. While assigning high Vth can limit the leakage power, embedded memory timing is critical to performance and draws an increasingly significant amount of leakage current. However, unlike in many processor based systems, on-chip memory accesses are often fully deterministic and completely under the control of the scheduler. In this paper we explore a variety of techniques to battle the problem of leakage in FPGA embedded memories that range in complexity and effectiveness. Through the addition of sleep and drowsy modes, controlled by the scheduler, the amount of leakage power can be reduced by several orders of magnitude. We show how even very simple schemes offer large amounts of benefit, and that further reductions are possible through careful leakage-aware data placement
Keywords
embedded systems; field programmable gate arrays; FPGA embedded memories; leakage power reduction; leakage-aware data placement; location assignment; Control systems; Digital systems; Distributed power generation; Field programmable gate arrays; Leakage current; Logic devices; Power dissipation; Reconfigurable logic; System-on-a-chip; Timing; Algorithms; Design; Embedded memory; Experimentation; Performance; leakage power; location assignment;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2006 43rd ACM/IEEE
Conference_Location
San Francisco, CA
ISSN
0738-100X
Print_ISBN
1-59593-381-6
Type
conf
DOI
10.1109/DAC.2006.229306
Filename
1688870
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