DocumentCode
2472470
Title
7E-6 Aluminum Nitride Bulk Acoustic Wave Devices with Iridium Bottom Electrodes
Author
Iborra, E. ; Clement, M. ; Olivares, J. ; Sangrador, J. ; Rimmer, N. ; Rastogi, A.
Author_Institution
Univ. Polytech. de Madrid, Madrid
fYear
2007
fDate
28-31 Oct. 2007
Firstpage
616
Lastpage
619
Abstract
Bulk acoustic wave (BAW) test resonators in the frequency range between 1.8 to 1.9 GHz were fabricated with piezoelectric aluminum nitride (AIN) films sputtered on iridium (Ir) bottom electrodes. The crystal structure and piezoelectric response of AIN films grown on Ir were as good as those of the best AIN films grown on other metallic electrodes, like platinum (Pt), molybdenum (Mo) or tungsten (W). Solidly mounted resonators (SMR) test devices with a single low-impedance layer of silicon dioxide (SiO2) for acoustic isolation were used for the preliminary assessment of both the piezoelectric activity of AIN and the influence of the iridium layer on the performance of the devices. The transversal electromechanical coupling factor of the AIN films was derived by fitting the electrical response of the resonators to Mason´s physical model, which allowed us to obtain a material dependent coupling factor. AIN films exhibited very high coupling factors (7.5 %) barely dependent on the width of the rocking curve (RC) around the AIN 00-2 reflection. The high acoustic impedance of the Ir bottom electrode reduced the mechanical losses of the BAW resonators, which exhibited higher quality factors than resonators built on lighter Mo bottom electrodes. The influence of the thickness of Ir and Mo bottom electrodes in the performance of the devices was also compared.
Keywords
acoustic resonators; aluminium compounds; bulk acoustic wave devices; crystal resonators; iridium; piezoelectric thin films; piezoelectricity; AlN; Ir; Mason physical model; acoustic isolation; aluminum nitride; bulk acoustic wave test resonators; crystal structure; frequency 1.8 GHz to 1.9 GHz; iridium bottom electrodes; piezoelectric response; piezoelectric thin films; silicon dioxide layer; solidly mounted resonators; transversal electromechanical coupling factor; Acoustic devices; Acoustic testing; Acoustic waves; Aluminum nitride; Bulk acoustic wave devices; Electrodes; Film bulk acoustic resonators; Optical films; Piezoelectric films; Resonant frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2007. IEEE
Conference_Location
New York, NY
ISSN
1051-0117
Print_ISBN
978-1-4244-1384-3
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2007.160
Filename
4409733
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