• DocumentCode
    2472977
  • Title

    THz semiconductor-based front-end receiver technology for space applications

  • Author

    Mehdi, Imran ; Siegel, Peter

  • Author_Institution
    Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    2004
  • fDate
    19-22 Sept. 2004
  • Firstpage
    127
  • Lastpage
    130
  • Abstract
    Advances in the design and fabrication of very low capacitance planar Schottky diodes and millimeterwave power amplifiers, more accurate device and circuit models for commercial 3D electromagnetic simulators, and the availability of both MEMS and high precision metal machining, have enabled RF engineers to extend traditional waveguide-based sensor and source technologies well into the THz frequency regime. This short paper highlights recent progress in realizing THz space-qualified receiver front-ends based on room temperature semiconductor devices.
  • Keywords
    Schottky diodes; micromechanical devices; millimetre wave power amplifiers; space vehicle electronics; submillimetre wave detectors; submillimetre wave generation; submillimetre wave receivers; 300 to 3000 GHz; 3D electromagnetic simulators; MEMS; THz room temperature semiconductor devices; high precision metal machining; millimeterwave power amplifiers; semiconductor-based front-end receiver technology; space-qualified receiver front-ends; very low capacitance planar Schottky diodes; waveguide-based sensors; waveguide-based sources; Capacitance; Electromagnetic modeling; Electromagnetic waveguides; High power amplifiers; Millimeter wave technology; Optical device fabrication; Radiofrequency amplifiers; Schottky diodes; Space technology; VHF circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio and Wireless Conference, 2004 IEEE
  • Print_ISBN
    0-7803-8451-2
  • Type

    conf

  • DOI
    10.1109/RAWCON.2004.1389089
  • Filename
    1389089