DocumentCode
2472977
Title
THz semiconductor-based front-end receiver technology for space applications
Author
Mehdi, Imran ; Siegel, Peter
Author_Institution
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fYear
2004
fDate
19-22 Sept. 2004
Firstpage
127
Lastpage
130
Abstract
Advances in the design and fabrication of very low capacitance planar Schottky diodes and millimeterwave power amplifiers, more accurate device and circuit models for commercial 3D electromagnetic simulators, and the availability of both MEMS and high precision metal machining, have enabled RF engineers to extend traditional waveguide-based sensor and source technologies well into the THz frequency regime. This short paper highlights recent progress in realizing THz space-qualified receiver front-ends based on room temperature semiconductor devices.
Keywords
Schottky diodes; micromechanical devices; millimetre wave power amplifiers; space vehicle electronics; submillimetre wave detectors; submillimetre wave generation; submillimetre wave receivers; 300 to 3000 GHz; 3D electromagnetic simulators; MEMS; THz room temperature semiconductor devices; high precision metal machining; millimeterwave power amplifiers; semiconductor-based front-end receiver technology; space-qualified receiver front-ends; very low capacitance planar Schottky diodes; waveguide-based sensors; waveguide-based sources; Capacitance; Electromagnetic modeling; Electromagnetic waveguides; High power amplifiers; Millimeter wave technology; Optical device fabrication; Radiofrequency amplifiers; Schottky diodes; Space technology; VHF circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio and Wireless Conference, 2004 IEEE
Print_ISBN
0-7803-8451-2
Type
conf
DOI
10.1109/RAWCON.2004.1389089
Filename
1389089
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