• DocumentCode
    2473338
  • Title

    Fine pattern fabrication below 100 nm with 70 kV cell projection electron beam

  • Author

    Yamamoto, J. ; Murai, F. ; Someda, Y. ; Uchino, S.

  • Author_Institution
    Central Res. Lab., Hitachi Ltd., Tokyo, Japan
  • fYear
    2000
  • fDate
    11-13 July 2000
  • Firstpage
    142
  • Lastpage
    143
  • Abstract
    A cell projection electron beam (EB) lithography technique has been investigated to achieve high throughput and its system has come onto the market. However cell projection method flow huge beam current, and then Coulomb interaction by electrical repulsion grow larger. The Coulomb effect causes a blur and results in degradation of resolution. This means large area electron beam exposure does not always increase throughput for fine patterns. This paper describes the effects of the acceleration voltage on resolution and throughput of fine patterns below 100 nm by experiments and simulations.
  • Keywords
    electron beam lithography; 100 nm; 70 kV; Coulomb interaction; acceleration voltage; cell projection electron beam lithography; fine pattern fabrication; resolution; throughput; Acceleration; Current density; Electron beams; Fabrication; Lithography; Particle beams; Resists; Space charge; Throughput; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microprocesses and Nanotechnology Conference, 2000 International
  • Conference_Location
    Tokyo, Japan
  • Print_ISBN
    4-89114-004-6
  • Type

    conf

  • DOI
    10.1109/IMNC.2000.872664
  • Filename
    872664