DocumentCode
2473338
Title
Fine pattern fabrication below 100 nm with 70 kV cell projection electron beam
Author
Yamamoto, J. ; Murai, F. ; Someda, Y. ; Uchino, S.
Author_Institution
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
fYear
2000
fDate
11-13 July 2000
Firstpage
142
Lastpage
143
Abstract
A cell projection electron beam (EB) lithography technique has been investigated to achieve high throughput and its system has come onto the market. However cell projection method flow huge beam current, and then Coulomb interaction by electrical repulsion grow larger. The Coulomb effect causes a blur and results in degradation of resolution. This means large area electron beam exposure does not always increase throughput for fine patterns. This paper describes the effects of the acceleration voltage on resolution and throughput of fine patterns below 100 nm by experiments and simulations.
Keywords
electron beam lithography; 100 nm; 70 kV; Coulomb interaction; acceleration voltage; cell projection electron beam lithography; fine pattern fabrication; resolution; throughput; Acceleration; Current density; Electron beams; Fabrication; Lithography; Particle beams; Resists; Space charge; Throughput; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2000 International
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-004-6
Type
conf
DOI
10.1109/IMNC.2000.872664
Filename
872664
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