DocumentCode
2474124
Title
Reduction in Shottky barrier height of AlGaN-based SBD with in-situ deposited silicon carbon nitride (SiCN) cap layer
Author
Jae-Hoon Lee ; Young-Sun Kwak ; Jae-Hyun Jeong ; Heon-Bok Lee ; Wantae Lim ; Ki-Se Kim ; Ki-Won Kim ; Dong-Suck Kim ; Jung-Hee Lee
Author_Institution
GaN Power Res. Group, Samsung LED Co., Ltd., Suwon, South Korea
fYear
2012
fDate
3-7 June 2012
Firstpage
249
Lastpage
252
Abstract
AlGaN/GaN Schottky barrier diodes (SBDs) with and without in-situ silicon carbon nitride (SiCN) cap layer were investigated. The fabricated SBD with SiCN cap layer exhibited improved electrical characteristics, such as the forward turn on voltage of about 0.7 V, the forward current of 4.1 A at 1.5 V, and the reverse breakdown voltage of 630 V, compared to the corresponding values of 0.8 V, 3.8 A, and 580 V for the reference SBD without the SiCN cap layer. This improvement in the device performance of the SiCN-SBD is because the in-situ SiCN cap layer not only lowers the barrier height, but also effectively passivates the surface of the device with better surface morphology.
Keywords
II-VI semiconductors; Schottky diodes; aluminium compounds; gallium compounds; silicon compounds; wide band gap semiconductors; AlGaN; SBD; Schottky barrier diodes; Schottky barrier height reduction; SiCN; current 3.8 A; in-situ silicon carbon nitride cap layer; reverse breakdown voltage; surface morphology; voltage 0.8 V; voltage 4.1 V to 1.5 V; voltage 580 V; voltage 630 V; Aluminum gallium nitride; Gallium nitride; HEMTs; Leakage current; MODFETs; Surface morphology; Surface treatment; AlGaN/GaN; Schttoky barrier diode (SBD); in-situ; silicon carbon nitride (SiCN);
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
Conference_Location
Bruges
ISSN
1943-653X
Print_ISBN
978-1-4577-1594-5
Electronic_ISBN
1943-653X
Type
conf
DOI
10.1109/ISPSD.2012.6229070
Filename
6229070
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