DocumentCode
2474168
Title
Ultra high voltage (>12 kV), high performance 4H-SiC IGBTs
Author
Ryu, Sei-Hyung ; Capell, Craig ; Jonas, Charlotte ; Cheng, Lin ; O´Loughlin, Michael ; Burk, Al ; Agarwal, Anant ; Palmour, John ; Hefner, Allen
Author_Institution
Cree, Inc., Durham, NC, USA
fYear
2012
fDate
3-7 June 2012
Firstpage
257
Lastpage
260
Abstract
We present our latest developments in ultra high voltage 4H-SiC IGBTs. A 4H-SiC P-IGBT, with a chip size of 6.7 mm × 6.7 mm and an active area of 0.16 cm2 exhibited a record high blocking voltage of 15 kV, while showing a room temperature differential specific on-resistance of 24 mΩ-cm2 with a gate bias of -20 V. A 4H-SiC N-IGBT with the same area showed a blocking voltage of 12.5 kV, and demonstrated a room temperature differential specific on-resistance of 5.3 mΩ-cm2 with a gate bias of 20 V. Buffer layer design, which includes controlling the doping concentration and the thickness of the field-stop buffer layers, was used to control the charge injection from the backside. Effects on buffer layer design on static characteristics and switching behavior are reported.
Keywords
buffer layers; insulated gate bipolar transistors; semiconductor doping; silicon compounds; 4H-SiC P-IGBT; SiC; blocking voltage; buffer layer design; doping concentration; switching behavior; Buffer layers; Doping; Insulated gate bipolar transistors; Integrated circuits; Logic gates; Performance evaluation; Temperature measurement; IGBT; silicon carbide; ultra high voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
Conference_Location
Bruges
ISSN
1943-653X
Print_ISBN
978-1-4577-1594-5
Electronic_ISBN
1943-653X
Type
conf
DOI
10.1109/ISPSD.2012.6229072
Filename
6229072
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