• DocumentCode
    2474168
  • Title

    Ultra high voltage (>12 kV), high performance 4H-SiC IGBTs

  • Author

    Ryu, Sei-Hyung ; Capell, Craig ; Jonas, Charlotte ; Cheng, Lin ; O´Loughlin, Michael ; Burk, Al ; Agarwal, Anant ; Palmour, John ; Hefner, Allen

  • Author_Institution
    Cree, Inc., Durham, NC, USA
  • fYear
    2012
  • fDate
    3-7 June 2012
  • Firstpage
    257
  • Lastpage
    260
  • Abstract
    We present our latest developments in ultra high voltage 4H-SiC IGBTs. A 4H-SiC P-IGBT, with a chip size of 6.7 mm × 6.7 mm and an active area of 0.16 cm2 exhibited a record high blocking voltage of 15 kV, while showing a room temperature differential specific on-resistance of 24 mΩ-cm2 with a gate bias of -20 V. A 4H-SiC N-IGBT with the same area showed a blocking voltage of 12.5 kV, and demonstrated a room temperature differential specific on-resistance of 5.3 mΩ-cm2 with a gate bias of 20 V. Buffer layer design, which includes controlling the doping concentration and the thickness of the field-stop buffer layers, was used to control the charge injection from the backside. Effects on buffer layer design on static characteristics and switching behavior are reported.
  • Keywords
    buffer layers; insulated gate bipolar transistors; semiconductor doping; silicon compounds; 4H-SiC P-IGBT; SiC; blocking voltage; buffer layer design; doping concentration; switching behavior; Buffer layers; Doping; Insulated gate bipolar transistors; Integrated circuits; Logic gates; Performance evaluation; Temperature measurement; IGBT; silicon carbide; ultra high voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
  • Conference_Location
    Bruges
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4577-1594-5
  • Electronic_ISBN
    1943-653X
  • Type

    conf

  • DOI
    10.1109/ISPSD.2012.6229072
  • Filename
    6229072