• DocumentCode
    2474347
  • Title

    Weibull statistical analysis of area effect on the breakdown strength in polymer films

  • Author

    Ul-Haq, Saeed ; Raju, G. R Govinda

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Windsor Univ., Ont., Canada
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    518
  • Lastpage
    521
  • Abstract
    The area and film thickness effects on the breakdown strength were examined for different polymer films at room temperature. Electrodes of four different diameters were used for this experimental work, which were in the range of 1/2 to 2 inches in diameter. Materials of various thickness used for this investigation were aramid paper (NOMEX type 410), Polyimide film (KAPTON), Mylar Polyester film, and Nomex-Polyester-Nomex composites. Two-parameter Weibull distribution has been used to analyze the results. The experimental analysis shows that the breakdown strength decreases as the electrode area increases. In case of thickness of 125 μm film, change of 10-12% in the breakdown strength was observed, where as for 25 μm thickness, 30-35% change in the breakdown strength was noticed. It was also noticed that the 25 μm thickness films are more exposed to the mechanical damage during handling process, thus chances of lower breakdown strength of such films are more, as probability of covering the mechanically damaged area increases with the increase in the electrode area.
  • Keywords
    Weibull distribution; electric breakdown; polymer films; KAPTON; Mylar Polyester film; NOMEX type 410; Nomex-Polyester-Nomex composite; Polyimide film; Weibull statistical analysis; aramid paper; breakdown strength; electrode area effect; handling process; mechanical damage; polymer film; thickness dependence; Circuit testing; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Polymer films; Statistical analysis; Stress; System testing; Temperature; Weibull distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2002 Annual Report Conference on
  • Print_ISBN
    0-7803-7502-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2002.1048847
  • Filename
    1048847