DocumentCode
2474998
Title
Power mos current sensefet temperature drift study and improvement by the help of 3D simulations
Author
Germana, R.
Author_Institution
Body & Audio Div., STMicroelectron., Peynier, France
fYear
2012
fDate
3-7 June 2012
Firstpage
413
Lastpage
416
Abstract
A sensefet monitoring is used for overload, open-load detection and load current analog feedback. The sensefet matching properties to the main power mos represent the main quality factor of the device. Its current should be proportional to the main power one, maintaining the same coefficient over the entire temperature and biasing working range. In this work the effects of the edge cells layout and process are analyzed by the help of 3D device simulations. The causes for the real to theoretical ratio mismatch and the drift behavior versus the temperature are put into evidence. The corrective actions allow to reach 1÷2% of drift in the range -40°C to 150°C. Only technological considerations are here faced, concerning the construction and optimization of the structure.
Keywords
electric sensing devices; feedback; power MOSFET; semiconductor device models; 3D device simulation; 3D simulations; edge cells layout; load current analog feedback; open-load detection; overload detection; power MOS current sensefet; sensefet matching; sensefet monitoring; structure construction; structure optimization; temperature -40 C to 150 C; temperature drift study; Doping; Immune system; Layout; Logic gates; Resistance; Temperature; Temperature sensors; Current sensing; Power mos; VDMOS; sense ratio; temperature drift;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs (ISPSD), 2012 24th International Symposium on
Conference_Location
Bruges
ISSN
1943-653X
Print_ISBN
978-1-4577-1594-5
Electronic_ISBN
1943-653X
Type
conf
DOI
10.1109/ISPSD.2012.6229109
Filename
6229109
Link To Document