DocumentCode
2475091
Title
Introduction
fYear
2009
fDate
19-21 Oct. 2009
Abstract
Presents the introductory welcome message from the conference proceedings.
Keywords
Educational institutions; Electronics industry; Electronics packaging; Government; High-speed electronics; Laboratories; Meeting planning; Performance analysis; Radio frequency; Signal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location
Portland, OR
Print_ISBN
978-1-4244-4447-2
Type
conf
DOI
10.1109/EPEPS.2009.5338492
Filename
5338492
Link To Document