DocumentCode
2475118
Title
Embedded tutorial: Challenges in high frequency measurement and simulation comparisons
Author
Melde, Kathleen L. ; Burcham, T.
Author_Institution
Electr. & Comput. Eng. Dept., Univ. of Arizona, Tucson, AZ, USA
fYear
2009
fDate
19-21 Oct. 2009
Firstpage
1
Lastpage
1
Abstract
High frequency modeling and simulation tools can be used to rapidly develop new packaging structures, yet the models must often be verified by comparison to broadband measurements. This tutorial will discuss some of the key issues involved in an accurate comparison of electromagnetic simulations with measurements. The important factors to consider include which measurement calibration method to use, how to fabricate the necessary calibration artifacts, and the impact that the calibration method may have on the measurement results. The increase in clock speeds and the push to higher frequencies of operation mean that many of the measurement approaches typically used at lower frequencies must be re-evaluated. The verification of accurate high frequency design and analysis tools mean that the measured results on the test structures must also be very accurate at increasingly higher frequencies.
Keywords
calibration; broadband measurements; calibration artifacts; electromagnetic simulation; high frequency design; high frequency measurement; high frequency modeling; high frequency simulation; measurement calibration; packaging structures; test structures; Calibration; Clocks; Electromagnetic measurements; Frequency measurement; Marketing management; Microwave amplifiers; Packaging; Testing; Tutorial; Velocity measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on
Conference_Location
Portland, OR
Print_ISBN
978-1-4244-4447-2
Electronic_ISBN
978-1-4244-5646-8
Type
conf
DOI
10.1109/EPEPS.2009.5338494
Filename
5338494
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